Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%) в рублях |
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Plasma display panels - Part 4:Environmental and mechanical endurance test methods
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Plasma display panels - Part 5:Generic specification
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LED modules for general lighting - Safety specifications
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Semiconductor devices - MEMS devices - Part 5: RF MEMS switches
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SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
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Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
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Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
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Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
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Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1 - 1:Pull strength test
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Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
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Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
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Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
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Single crystal wafers for surface acoustic wave(SAW) device applications - Specifications and measuring methods
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Determination of certain substances in electrotechnical products - Part 7-2: Hexavalent chromium - Determination of hexavalent chromium[Cr(VI)] in polymers and electronics by the colorimetric method
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Printed boards - Part 1:Generic specification
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Printed boards - Part 4:Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1:Capability Detail Specification - Performance levels A, B, and C
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Printed boards - Part 4:Rigid multilayer printed boards with interlayer connections - Sectional specification
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Printed boards - Part 14:Device embedded substrate - Terminology/reliability/design guide
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