| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 22%)
в рублях |
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The rule of type designation for discrete semiconductor devices
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Published |
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На языке оригинала
|
993,00
|
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Semiconductor devices-Discrete devices and integrated circuits-_x000D_ Part 2: Rectifier diodes
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Published |
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На языке оригинала
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3805,00
|
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Semiconductor devices--Discrete devices--Part 8:Field-effect transistors
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Published |
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На языке оригинала
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2895,00
|
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Semiconductor devices-Discrete devices-Part 7:Bipolar transistors
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Published |
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На языке оригинала
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5046,00
|
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Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
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Published |
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На языке оригинала
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2440,00
|
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Semiconductor devices-Mechanical and climatic test methods-Part 1: General
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Published |
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На языке оригинала
|
993,00
|
|
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Semiconductor devices-Mechanical and climatic test methods-Part 2: Low air pressure
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Published |
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На языке оригинала
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993,00
|
|
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Semiconductor devices - Mechanical and climatic tests methods - Part 3: External visual examination
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Published |
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На языке оригинала
|
993,00
|
|
|
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Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
|
Published |
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На языке оригинала
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993,00
|
|
|
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Semiconductor devices-Mechanical and climatic test methods-Part 11: Rapid change of temperature-Two-fluid-bath method
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Published |
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На языке оригинала
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993,00
|
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Semiconductor devices-Mechanical and climatic test methods-Part 12: Vibration, variable frequency
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Published |
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На языке оригинала
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993,00
|
|
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Semiconductor devices-Mechanical and climatic test methods-Part 13: Salt atmosphere
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Published |
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На языке оригинала
|
993,00
|
|
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Semiconductor devices-Mechanical and climatic test methods-Part 14: Robustness of terminationslead integrity
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Published |
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На языке оригинала
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1282,00
|
|
|
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Semiconductor devices-Mechanical and climatic test methods-Part 15: Resistance to soldering temperature for through-hole mounted devices
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Published |
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На языке оригинала
|
993,00
|
|
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Semiconductor devices-Mechanical and climatic test methods-Part 16: Particle impact noise detection(PIND)
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Published |
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На языке оригинала
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1282,00
|
|
|
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Semiconductor devices-Mechanical and climatic test methods-Part 17: Neutron irradiation
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Published |
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На языке оригинала
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993,00
|
|
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Semiconductor devices-Mechanical and climatic test methods-Part 18: Ionizing radiation (total dose)
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Published |
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На языке оригинала
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1199,00
|
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Semiconductor devices-Mechanical and climatic test methods-Part 19: Die shear strength
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Published |
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На языке оригинала
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993,00
|
|
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Semiconductor devices-Mechanical and climatic test methods-Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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Published |
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На языке оригинала
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1778,00
|
|
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Semiconductor devices-Mechanical and climatic test methods-Part 21: Solderability
|
Published |
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На языке оригинала
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1572,00
|
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| Страницы: 1 / 2 / 3 / 4 / 5 / 6 |