| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
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Semiconductor devices—Part 5-5: Optoelectronic devices—Photocouplers
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Published |
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На языке оригинала
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4666,00
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Semiconductor devices—Part 5-6: Optoelectronic devices—Light emitting diodes
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Published |
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На языке оригинала
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6221,00
|
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Semiconductor devices—Part 5-7: Optoelectronic devices—Photodiodes and phototransistors
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Published |
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На языке оригинала
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2477,00
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Semiconductor devices--Discrete devices and integrated circuits--Part 5:Optoelectronic devices
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Published |
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На языке оригинала
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7488,00
|
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Generic specification for gas sensors of metal-oxide semiconductor
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Published |
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На языке оригинала
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1786,00
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Measuring methods for gas sensors of metal-oxide semiconductor
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Published |
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На языке оригинала
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1670,00
|
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Fixed film resistor networks for use in electronic equipment--Part 1:Generic specification
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Published |
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На языке оригинала
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3110,00
|
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General specification for the capacitance type humidity sensor and transducer
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Published |
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На языке оригинала
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2189,00
|
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Power supply interface for semiconductor equipment
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Published |
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На языке оригинала
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1670,00
|
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Directives for drafting semiconductor facilities interface specification
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Published |
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На языке оригинала
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1786,00
|
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Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package
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Published |
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На языке оригинала
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2189,00
|
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Semiconductor integrated circuits—Specification of DIP leadframes produced by etching
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Published |
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На языке оригинала
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1670,00
|
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Semiconductor integrated circuits—Specification of leadframes for small outline package
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Published |
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На языке оригинала
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1786,00
|
|
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Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
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Published |
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На языке оригинала
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2189,00
|
|
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Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits
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Published |
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На языке оригинала
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3744,00
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Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)
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Published |
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На языке оригинала
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2189,00
|
|
|
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Potentiometers for use in electronic equipment--Part 3:Sectional specification--Rotary precision potentiometers
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Published |
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На языке оригинала
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2477,00
|
|
|
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Potentiometers for use in electronic equipment--Part 3:Blank detail specification--Rotary precision potentiometers--Assessment level E
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Published |
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На языке оригинала
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2189,00
|
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General specification for printed circuit boards
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Published |
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На языке оригинала
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2189,00
|
|
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Polymide woven glass fabric copper clad laminated sheets for printed circuits
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Published |
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На языке оригинала
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1670,00
|
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