| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
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Semiconductor devices--Integrated circuits--Part 1:General
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Published |
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На языке оригинала
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2477,00
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Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
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Published |
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На языке оригинала
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3744,00
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Blank detailspecification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
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Published |
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На языке оригинала
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1670,00
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Fixed capacitors for use in electronic equipment―Part 19-1: Blank detail specification—Fixed metallized polyethylene-terephthalate film dielectric surface mount d.c.capacitors―Assessment level EZ
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Published |
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На языке оригинала
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1786,00
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Fixed inductors for radio interference suppression--Part 1:Generic specification
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Published |
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На языке оригинала
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2189,00
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Fixed inductors for radio interference suppression--Part 2:Sectional specification--Selection of methods of test and general requirements
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Published |
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На языке оригинала
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2189,00
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Electromechanical switches for use in electronic equipment Part 5:Sectional specification for pushbutton switches Section 1-Blank detail specification
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Published |
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На языке оригинала
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1670,00
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Potentiometers for use in electronic equipment—Part 5: Sectional specification—Single-turn rotary low-power wirewound and non-wirewound potentiometers
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Published |
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На языке оригинала
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2822,00
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Quartz crystal units--A specification in the quality assessment system for electronic components--Part 2:Sectional specification--Capability approval
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Published |
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На языке оригинала
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2477,00
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Quartz crystal units--A specification in the quality assessment system for electronic components--Part 3:Sectional specification--Qualification approval
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Published |
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На языке оригинала
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1786,00
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Specification for round quartz photomask substrates
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Published |
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На языке оригинала
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1670,00
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Specification for registration marks for photomasks
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Published |
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На языке оригинала
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1382,00
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Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package
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Published |
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На языке оригинала
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2189,00
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Test method of measuring the lead-to-lead and loading capacitance of package leads
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Published |
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На языке оригинала
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1382,00
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Specification for photoresist/E-beam resist for hard surface photoplates
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Published |
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На языке оригинала
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1670,00
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Measuring method for polarization dependence of return loss of a single-mode fibre optic component
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Published |
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На языке оригинала
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1670,00
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Lasers and laser-related equipment—Test methods for laser-induced damage threshold—Part 1: Definitions and general principles
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Published |
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На языке оригинала
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2189,00
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Lasers and laser-related equipment—Test methods for laser-induced damage threshold—Part 2: Threshold determination
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Published |
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На языке оригинала
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3398,00
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Lasers and laser-related equipment—Test methods for laser-induced damage threshold—Part 3: Assurance of laser power(energy)handling capabilities
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Published |
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На языке оригинала
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1786,00
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Lasers and laser-related equipment—Test methods for laser-induced damage threshold—Part 4: Inspection,detection and measurement
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Published |
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На языке оригинала
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2074,00
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