| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
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Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories
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Published |
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На языке оригинала
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1642,00
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Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory
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Published |
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На языке оригинала
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1339,00
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Semiconductor devices - Integrated circuits - Part 2-20пјљDigital integrated circuits - Family specification - Low voltage integrated circuits
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Published |
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На языке оригинала
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1037,00
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Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits
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Published |
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На языке оригинала
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7603,00
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Capacitors for power electronics
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Published |
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На языке оригинала
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3024,00
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CD Metrology procedures
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Published |
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На языке оригинала
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1253,00
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Specification for measuring depth of focus and best focus
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Published |
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На языке оригинала
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1253,00
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Guideline for programmed defect masks and benchmark procedures for sensitivity analysisof mask defect inspection systems
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Published |
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На языке оригинала
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1339,00
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Shunt power capacitors of the non-self-healing type for a.c.systems having a rated voltage up to and including 1 kV--Part 1:General--PerformanceпјЊtesting and rating--Safety requirements--Guide for installation and operation
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Published |
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На языке оригинала
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2117,00
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Shunt power capacitors of the non-self-healing type for a.c.systems having a rated voltage up to and including 1 kV--Part 2:Ageing test and destruction test
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Published |
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На языке оригинала
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1037,00
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Shut power capacitor of the non-self-healing type for a.c. systems having arated voltage up to and including 1 kV--Part 3:Internal fuses
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Published |
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На языке оригинала
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1253,00
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Semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits
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Published |
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На языке оригинала
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6998,00
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Solderless connections— Part 2：Crimped connections—General requirements,test methods and practical guidance
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Published |
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На языке оригинала
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3024,00
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Solderless connections—_x000D_
Part 4: Solderless non-accessible insulation displacement connections—_x000D_
General requirements, test methods and practical guidance
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Published |
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На языке оригинала
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2549,00
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Solderless connections—Part 5: Press-in connections—General requirements, test methods and practical guidance
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Published |
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На языке оригинала
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2117,00
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Specification for flexible multilayer printed boards with through conections
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Published |
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На языке оригинала
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2549,00
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Specification for flex-rigid multilayer printed boards with through connections
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Published |
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На языке оригинала
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2549,00
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Laser processing machines—Performance specifications for metal cutting
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Published |
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На языке оригинала
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1339,00
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Safety of machinery—Laser processing machines—Part 1：General safety requirement
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Published |
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На языке оригинала
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1642,00
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Safety of machinery—Laser processing machines—Part 2: Safety requirements for hand-held laser processing devices
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Published |
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На языке оригинала
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1858,00
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