| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
|
|
Test methods for flip chip integrated circuits
|
Published |
|
На языке оригинала
|
2189,00
|
|
|
|
Semiconductor integrated circuits—Measuring method of level converter
|
Published |
|
На языке оригинала
|
3110,00
|
|
|
|
Semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry
|
Published |
|
На языке оригинала
|
3744,00
|
|
|
|
Specification for serial NOR flash interface
|
Published |
|
На языке оригинала
|
3398,00
|
|
|
|
Specification for serial NAND flash interface
|
Published |
|
На языке оригинала
|
3110,00
|
|
|
|
Semiconductor die products—Part 1：Requirements for procurement and use
|
Published |
|
На языке оригинала
|
3744,00
|
|
|
|
Semiconductor die products—Part 2: Exchange data formats
|
Published |
|
На языке оригинала
|
4954,00
|
|
|
|
Semiconductor die products—Part 3: Guide for handling, packing and storage
|
Published |
|
На языке оригинала
|
3110,00
|
|
|
|
Semiconductor die products—Part 4: Requirements for die users and suppliers
|
Published |
|
На языке оригинала
|
2189,00
|
|
|
|
Semiconductor die products—Part 5：Requirements for concerning electrical simulation
|
Published |
|
На языке оригинала
|
1670,00
|
|
|
|
Semiconductor die products—Part 6: Requirements for concerning thermal simulation
|
Published |
|
На языке оригинала
|
1382,00
|
|
|
|
Semiconductor die products—Part 7: XML schema for data exchange
|
Published |
|
На языке оригинала
|
3398,00
|
|
|
|
Semiconductor die products—Part8: EXPRESS model schema for data exchange
|
Published |
|
На языке оригинала
|
2822,00
|
|
|
|
Microwave circuits—Measuring methods for voltage controlled oscillater
|
Published |
|
На языке оригинала
|
2189,00
|
|
|
|
General specification for MEMS electric field sensor
|
Published |
|
На языке оригинала
|
2189,00
|
|
|
|
Test methods of optical performance for Erbium-doped Yttrium Aluminum Garnet laser crystal
|
Published |
|
На языке оригинала
|
1670,00
|
|
|
|
Measuring methods of optical radiation safety for semiconductor lighting equipments and systems
|
Published |
|
На языке оригинала
|
1670,00
|
|
|
|
Evaluation requirements for obtrusive light of LED panels
|
Published |
|
На языке оригинала
|
1382,00
|
|
|
|
Technical specification for power light-emitting diode chips
|
Published |
|
На языке оригинала
|
2189,00
|
|
|
|
Technical specification for middle power light-emitting diode chips
|
Published |
|
На языке оригинала
|
2189,00
|
|
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