| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
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Micro-electromechanical system technology—Measuring method for residual strain measurements of MEMS microstructures using an optical interferometer
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Published |
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На языке оригинала
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1339,00
|
|
|
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On-site measurements of obstrusive light of LED panals
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Published |
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На языке оригинала
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1037,00
|
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Connectors—Safety requirements and tests
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Published |
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На языке оригинала
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2808,00
|
|
|
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Microwave circuits—Measuring methoels for noise source
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Published |
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На языке оригинала
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1253,00
|
|
|
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Microwave circuits—Measuring methods for frequency source
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Published |
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На языке оригинала
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1642,00
|
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Test methods for endurance and data retention of non-volatile memory
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Published |
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На языке оригинала
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1253,00
|
|
|
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Logic digital integrated circuits—Specification for I/O interface model for integrated circuit
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Published |
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На языке оригинала
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3542,00
|
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Test methods for flip chip integrated circuits
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Published |
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На языке оригинала
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1642,00
|
|
|
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Semiconductor integrated circuits—Measuring method of level converter
|
Published |
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На языке оригинала
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2333,00
|
|
|
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Semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry
|
Published |
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На языке оригинала
|
2808,00
|
|
|
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Specification for serial NOR flash interface
|
Published |
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На языке оригинала
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2549,00
|
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Specification for serial NAND flash interface
|
Published |
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На языке оригинала
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2333,00
|
|
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Semiconductor die products—Part 1：Requirements for procurement and use
|
Published |
|
На языке оригинала
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2808,00
|
|
|
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Semiconductor die products—Part 2: Exchange data formats
|
Published |
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На языке оригинала
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3715,00
|
|
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Semiconductor die products—Part 3: Guide for handling, packing and storage
|
Published |
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На языке оригинала
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2333,00
|
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Semiconductor die products—Part 4: Requirements for die users and suppliers
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Published |
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На языке оригинала
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1642,00
|
|
|
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Semiconductor die products—Part 5：Requirements for concerning electrical simulation
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Published |
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На языке оригинала
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1253,00
|
|
|
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Semiconductor die products—Part 6: Requirements for concerning thermal simulation
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Published |
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На языке оригинала
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1037,00
|
|
|
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Semiconductor die products—Part 7: XML schema for data exchange
|
Published |
|
На языке оригинала
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2549,00
|
|
|
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Semiconductor die products—Part8: EXPRESS model schema for data exchange
|
Published |
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На языке оригинала
|
2117,00
|
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