| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
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Aluminum nitride ceramic dissipate heat substrates
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Published |
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На языке оригинала
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1670,00
|
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|
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Determination of medium chain chlorinated paraffins in electrical and electronic products
|
Published |
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На языке оригинала
|
1786,00
|
|
|
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Determination of polychlorinated naphthalenes in electrical and electronic products—Gas chromatorgaphy-mass spectrometry method
|
Published |
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На языке оригинала
|
1670,00
|
|
|
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Restricted substance in electrical and electronic products—Determination of hexavalent chromium—Ion chromatography method
|
Published |
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На языке оригинала
|
1670,00
|
|
|
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Potentiometers for use in electronic equipment—Part 6:Sectional specification—Surface mount preset potentiometers
|
Published |
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На языке оригинала
|
2477,00
|
|
|
|
Terminology for integrated circuitпј€ICпј‰manufacturing equipment
|
Published |
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На языке оригинала
|
5299,00
|
|
|
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Potassium bromide optical elements
|
Published |
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На языке оригинала
|
2189,00
|
|
|
|
Mechanical structures for electrical and electronic equipment—Thermal management for cabinets in accordance with inch and metric system—Part 2: Method for the determination of forced air cooling
|
Published |
|
На языке оригинала
|
1786,00
|
|
|
|
Mechanical structures for electrical and electronic equipment—Thermal management for cabinets in accordance with inch and metric system—Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets
|
Published |
|
На языке оригинала
|
2189,00
|
|
|
|
Mechanical structures for electrical and electronic equipment—Thermal management for cabinets in accordance with inch and metric system—Part 5: Cooling performance evaluation for indoor cabinets
|
Published |
|
На языке оригинала
|
2822,00
|
|
|
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General guidelines for construction analysis components for space applications
|
Published |
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На языке оригинала
|
2189,00
|
|
|
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General specification for super high-low temperature circular electrical connector for space applications
|
Published |
|
На языке оригинала
|
2822,00
|
|
|
|
Integrated circuit full automatic die bonder
|
Published |
|
На языке оригинала
|
1786,00
|
|
|
|
Optical radiation safety requirements of wearable devices
|
Published |
|
На языке оригинала
|
3744,00
|
|
|
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Lasers and laser-related equipment—Laser device—Minimum requirements for documentation
|
Published |
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На языке оригинала
|
1786,00
|
|
|
|
Measurement methods for main parameters of pulsed laser in time-domain
|
Published |
|
На языке оригинала
|
3110,00
|
|
|
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Guidance and safety requirements for high power laser manufacturing equipments
|
Published |
|
На языке оригинала
|
2477,00
|
|
|
|
Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
|
Published |
|
На языке оригинала
|
1786,00
|
|
|
|
Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement
|
Published |
|
На языке оригинала
|
2477,00
|
|
|
|
Optics and photonics—Microlens array—Part 1:Vocabulary
|
Published |
|
На языке оригинала
|
3110,00
|
|
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