Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%) в рублях |
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Optics and photonics—Microlens array—Part 2:Test methods for wavefront aberrations
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Published |
На языке оригинала
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2189,00
|
|
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Micro-electromechanical systems technology(MEMS) —Description and measurement methods for micro trench and pyramidal needle structures
|
Published |
На языке оригинала
|
3456,00
|
|
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Test methods of the performances for MEMS piezoresistive pressure-sensitive device
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Published |
На языке оригинала
|
1786,00
|
|
|
Connectors for electronic equipment—Product requierments—Rectangular connectors—Part 5: Detail specification for rewirable power connectors with snap locking for rated voltage of 250 V d.c. and rated current of 30 A
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Published |
На языке оригинала
|
2822,00
|
|
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Point to Point (P2P) signal interface for liquid crystal display panels—Transport protocols
|
Published |
На языке оригинала
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5760,00
|
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Point to Point (P2P) signal interface for liquid crystal display panels—Electrical parameters
|
Published |
На языке оригинала
|
2189,00
|
|
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Method for measuring optical and laser performance for Chromium and Erbium co-doped Yttrium Scandium Gallium Garnet laser crystal
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Published |
На языке оригинала
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3110,00
|
|
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Potentiometers for use in electronic equipment—Part 6-1:Blank detail specification—Surface mount preset potentiometers—Assessment level EZ
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Published |
На языке оригинала
|
1786,00
|
|
|
Lasers and laser-related equipment—Test methods for the spectral characteristics of lasers
|
Published |
На языке оригинала
|
2822,00
|
|
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Technical requirements and testing methods of BDS/GNSS high precision system on chip (SoC)
|
Published |
На языке оригинала
|
2477,00
|
|
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Micro-electromechanical systems technology—Gyroscopes
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Published |
На языке оригинала
|
5299,00
|
|
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Electronic components—Long-term storage of electronic semiconductor devices—Part 1:General
|
Published |
На языке оригинала
|
3110,00
|
|
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Electronic components—Long-term storage of electronic semiconductor devices—Part 2:Deterioration mechanisms
|
Published |
На языке оригинала
|
2189,00
|
|
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Electronic components—Long-term storage of electronic semiconductor devices—Part 5:Die and wafer devices
|
Published |
На языке оригинала
|
2189,00
|
|
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Semiconductor devices—Micro-electromechanical devices—Part 5: RF MEMS switches
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Published |
На языке оригинала
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3398,00
|
|
|
Semiconductor devices—Micro-electromechanical devices—Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
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Published |
На языке оригинала
|
3168,00
|
|
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Semiconductor devices—Micro-electromechanical devices—Part 19: Electronic compasses
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Published |
На языке оригинала
|
2880,00
|
|
|
Technical requirements for L band 75kW continuous wave magnetron
|
Published |
На языке оригинала
|
2477,00
|
|
|
Microwave circuit—Measuring methods for electrically controlled attenuator
|
Published |
На языке оригинала
|
2477,00
|
|
|
Measuring methods of optical radiation safety for wearable devices
|
Published |
На языке оригинала
|
2189,00
|
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