| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
|
|
Workmanship requirements for rework, modification and repair of soldered electronic assemblies
|
Published |
|
На языке оригинала
|
3110,00
|
|
|
|
Guidelines for the measurement method of nonlinearity for surface acoustic wave (SAW) and bulk acoustic wave (BAW) devices in radio frequency (RF)
|
Published |
|
На языке оригинала
|
2189,00
|
|
|
|
Measurement techniques of piezoelectric,dielectric and electrostatic oscillators—Part 2: Phase jitter measurement method
|
Published |
|
На языке оригинала
|
2477,00
|
|
|
|
Measuring methods of converter modules for high voltage input power supplies
|
Published |
|
На языке оригинала
|
4954,00
|
|
|
|
Integrated circuits—Measurement of impulse immunity—Part 2: Synchronous transient injection method
|
Published |
|
На языке оригинала
|
2822,00
|
|
|
|
Integrated circuits—Measurement of impulse immunity—Part 3: Non-synchronous transient injection method
|
Published |
|
На языке оригинала
|
3110,00
|
|
|
|
Semiconductor devices—Integrated circuits—Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits—Section 1: Requirements for internal visual examination
|
Published |
|
На языке оригинала
|
2477,00
|
|
|
|
Semiconductor integrated circuits—Test method of AC/DC converters
|
Published |
|
На языке оригинала
|
4032,00
|
|
|
|
Hybrid integrated circuits—DC/DC converter
|
Published |
|
На языке оригинала
|
2189,00
|
|
|
|
Requirements of flatness control for printed boards and printed board assemblies
|
Published |
|
На языке оригинала
|
1670,00
|
|
|
|
Semiconductor integrated circuits—Test methods of PWM controller
|
Published |
|
На языке оригинала
|
4954,00
|
|
|
|
Integrated circuit—Test method for CMOS image sensors
|
Published |
|
На языке оригинала
|
3398,00
|
|
|
|
Surface acoustic wave (SAW) and bulk acoustic wave(BAW) duplexers of assessed quality—Part 1:Generic specification
|
Published |
|
На языке оригинала
|
2880,00
|
|
|
|
Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality—Part 2:Guidelines for the use
|
Published |
|
На языке оригинала
|
2650,00
|
|
|
|
General specification for separable and break-off connectors for aerospace
|
Published |
|
На языке оригинала
|
4378,00
|
|
|
|
Requirements for analog/mixed-signal intellectual property(IP) core deliverables
|
Published |
|
На языке оригинала
|
1670,00
|
|
|
|
Guideline for analog/mix-signal intellectual property(IP) core document structure
|
Published |
|
На языке оригинала
|
3110,00
|
|
|
|
Design requirements of integrated circuit intellectual property (IP) core
|
Published |
|
На языке оригинала
|
1786,00
|
|
|
|
Analog/mixed-signal intellectural property(IP)core quality evaluation
|
Published |
|
На языке оригинала
|
2822,00
|
|
|
|
Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 1: Classification of defects
|
Published |
|
На языке оригинала
|
2477,00
|
|
| Страницы: ... / 34 / 35 / 36 / 37 / 38 / 39 / 40 / 41 / 42 / 43 / 44 / 45 |