| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
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Sectional specification for high density interconnect printed boards
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Published |
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На языке оригинала
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4090,00
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Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency—Split post dielectric resonator method
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Published |
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На языке оригинала
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2822,00
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Touch and interactive displays—Part 1-2: Terminology and letter symbols
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Published |
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На языке оригинала
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2477,00
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Touch and interactive displays—Part 12-10: Measurement methods of touch displays—Touch and electrical performance
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Published |
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На языке оригинала
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4032,00
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Touch and interactive displays—Part 12-20: Measurement methods of touch displays—Multi-touch performance
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Published |
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На языке оригинала
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2477,00
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Format for LSI—Package—Board interoperable design
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Published |
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На языке оригинала
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11866,00
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Display lighting unit—Part 1-2: Terminology and letter symbols
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Published |
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На языке оригинала
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3744,00
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General specification for microwave integrated circuit chip for aerospace
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Published |
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На языке оригинала
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2822,00
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4 Mb/s digital time division command/response multiplex data bus test plan
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Published |
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На языке оригинала
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5933,00
|
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Remote operation and maintenance of integrated circuit packaging equipment—Status monitoring
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Published |
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На языке оригинала
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2477,00
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Evaluation requirements for visual comfort of indoor LED displays
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Published |
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На языке оригинала
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1670,00
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Evaluation methods for visual comfort of indoor LED displays
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Published |
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На языке оригинала
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2189,00
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Rules for the representation of infrared image temperature—Method by RGB
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Published |
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На языке оригинала
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4666,00
|
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Transparent display devices—Part 41: Measuring methods—Optical performance
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Published |
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На языке оригинала
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3744,00
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Image measurement method for numerical aperture of microscopic objective
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Published |
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На языке оригинала
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2189,00
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Epoxide woven E-glass prepreg for multilayer printed boards
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Published |
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На языке оригинала
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2822,00
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Requirements for load ports of 300mm semiconductor equipment
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Published |
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На языке оригинала
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1786,00
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Micro-electromechanical systems (MEMS) technology—Environmental test methods of MEMS piezoelectric thin films for sensor application
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Published |
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На языке оригинала
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2477,00
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Micro-electromechanical systems (MEMS) technology—Four-point bending test method for interfacial adhesion energy of layered MEMS materials
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Published |
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На языке оригинала
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1786,00
|
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Micro-electromechanical systems (MEMS) technology—Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
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Published |
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На языке оригинала
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2189,00
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