| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
|
|
Micro-electromechanical systems (MEMS) technology—Wafer curvature and cantilever beam deflection test methods for determining residual stresses of MEMS films
|
Published |
|
На языке оригинала
|
1786,00
|
|
|
|
Micro-electromechanical systems（MEMS）technology—Radio frequency MEMS circulators and isolators
|
Published |
|
На языке оригинала
|
3398,00
|
|
|
|
Micro-electromechanical systems（MEMS）technology—Technical specification of automotive grade pressure sensor based on MEMS technology
|
Published |
|
На языке оригинала
|
2189,00
|
|
|
|
Optics crystal—Ultraviolet grade calcium fluride crystal
|
Published |
|
На языке оригинала
|
1786,00
|
|
|
|
Laser and laser-related equipment—Absorption distribution measurement of optical laser components—Photothermal mapping method
|
Published |
|
На языке оригинала
|
2822,00
|
|
|
|
Requirements for wafer carrier handoff parallel I/O interface
|
Published |
|
На языке оригинала
|
3744,00
|
|
|
|
Electrostatic discharge sensitivity testing—Transmission line pulse(TLP)—Component level
|
Published |
|
На языке оригинала
|
2477,00
|
|
|
|
Microwave circuits—Measuring methods for limiter
|
Published |
|
На языке оригинала
|
2477,00
|
|
|
|
Integrated circuit 3D packaging— Requirement for die stack process and evaluation
|
Published |
|
На языке оригинала
|
2822,00
|
|
|
|
Guideline for intellectual property(IP) core protection
|
Published |
|
На языке оригинала
|
2189,00
|
|
|
|
Integrated circuit 3D packaging—Requirement for bumping-wafer-thining process and evaluation
|
Published |
|
На языке оригинала
|
1786,00
|
|
|
|
General requirements for integral substrate of System in Packageпј€SiPпј‰
|
Published |
|
На языке оригинала
|
2822,00
|
|
|
|
Integrated circuit 3D packaging—Requirement for bumping-wafer-sawing process and evaluation
|
Published |
|
На языке оригинала
|
1786,00
|
|
|
|
Design assurance guidelines for complex integrated circuits
|
Published |
|
На языке оригинала
|
2477,00
|
|
|
|
Terminology of system in packgaeпј€SiPпј‰
|
Published |
|
На языке оригинала
|
2477,00
|
|
|
|
Integrated circuits—EMC evaluation of transceivers—Part 1:General conditions and definitions
|
Published |
|
На языке оригинала
|
1670,00
|
|
|
|
EMC IC modelling—Part 1:General modelling framework
|
Published |
|
На языке оригинала
|
5587,00
|
|
|
|
Lasers and laser-related equipment—Test methods for laser beam polarization parameters
|
Published |
|
На языке оригинала
|
2189,00
|
|
|
|
Micro-electromechanical systems (MEMS) technologyдёЂMicro-pillar compression test for MEMS materials
|
Published |
|
На языке оригинала
|
2189,00
|
|
|
|
Micro-electromechanical systems （MEMS） technology—Bend testing methods of thin film materials
|
Published |
|
На языке оригинала
|
1786,00
|
|
| Страницы: ... / 37 / 38 / 39 / 40 / 41 / 42 / 43 / 44 / 45 |