| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
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Three dimensional integrated circuits—Part 2：Alignment of stacked dies having fine pitch interconnect
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Published |
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На языке оригинала
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1339,00
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Quality and technical requirements for metal packages used for integrated circuits
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Published |
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На языке оригинала
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2549,00
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General specification for microwave integrated circuit chip for aerospace
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Published |
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На языке оригинала
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2117,00
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4 Mb/s digital time division command/response multiplex data bus test plan
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Published |
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На языке оригинала
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4450,00
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Microwave circuits—Measuring methods for limiter
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Published |
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На языке оригинала
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1858,00
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Integrated circuit 3D packaging— Requirement for die stack process and evaluation
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Published |
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На языке оригинала
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2117,00
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Guideline for intellectual property(IP) core protection
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Published |
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На языке оригинала
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1642,00
|
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Integrated circuit 3D packaging—Requirement for bumping-wafer-thining process and evaluation
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Published |
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На языке оригинала
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1339,00
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General requirements for integral substrate of System in Packageпј€SiPпј‰
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Published |
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На языке оригинала
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2117,00
|
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Integrated circuit 3D packaging—Requirement for bumping-wafer-sawing process and evaluation
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Published |
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На языке оригинала
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1339,00
|
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Microwave hybrid integrated circuits—Synthesized frequency sources
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Published |
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На языке оригинала
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1339,00
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Design assurance guidelines for complex integrated circuits
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Published |
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На языке оригинала
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1858,00
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Terminology of system in packgaeпј€SiPпј‰
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Published |
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На языке оригинала
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1858,00
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Integrated circuits—EMC evaluation of transceivers—Part 1:General conditions and definitions
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Published |
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На языке оригинала
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1253,00
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EMC IC modelling—Part 1:General modelling framework
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Published |
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На языке оригинала
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4190,00
|
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Semiconductor integrated circuits—Measuring methods for RF transmitter/receiver
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Published |
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На языке оригинала
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4450,00
|
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Integrated circuits—Measurement of electromagnetic emissions—Part 4: Measurement of conducted emissions—1Ω/150Ω direct coupling method
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Published |
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На языке оригинала
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3283,00
|
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Integrated circuit TSV 3D package reliability test methods guideline
|
Published |
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На языке оригинала
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1253,00
|
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| Страницы: 1 / 2 / 3 / 4 / 5 / 6 / 7 / 8 |