Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%) в рублях |
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Copper-clad polyester film laminates for flexible printed circuits
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Published |
На языке оригинала
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1786,00
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Test methods for copper-clad material for flexible printed circuits
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Published |
На языке оригинала
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3110,00
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Sectional specification for single and double sided flexible printed board
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Published |
На языке оригинала
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4666,00
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Adhesive coated polyester film for flexible printed circuits
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Published |
На языке оригинала
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1786,00
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Adhesive coated polyimide film for flexible printed circuits
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Published |
На языке оригинала
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2189,00
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General specification for printed circuit boards
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Published |
На языке оригинала
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2189,00
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Polymide woven glass fabric copper clad laminated sheets for printed circuits
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Published |
На языке оригинала
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1670,00
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Specification for flexible multilayer printed boards with through conections
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Published |
На языке оригинала
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3398,00
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Specification for flex-rigid multilayer printed boards with through connections
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Published |
На языке оригинала
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3398,00
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Printed board assemblies—Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
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Published |
На языке оригинала
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3744,00
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Specifications for membrane key board
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Published |
На языке оригинала
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2189,00
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General specification for metal foil for printed circuits
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Published |
На языке оригинала
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2477,00
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Aluminium base copper clad laminate for printed circuits
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Published |
На языке оригинала
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2822,00
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General rules for bonding sheet for multilayer printed boards
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Published |
На языке оригинала
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1786,00
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Test methods for bongding sheet for multilayer printed boards
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Published |
На языке оригинала
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3744,00
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Quality assessment systems—Part 1: Registration and analysis of defects on printed board assemblies
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Published |
На языке оригинала
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1786,00
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General specification for metal base copper-clad laminates for printed circuits
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Published |
На языке оригинала
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3110,00
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Aerospace electronic products—General specification for printed circuit board
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Published |
На языке оригинала
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2822,00
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Requirements of flatness control for printed boards and printed board assemblies
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Published |
На языке оригинала
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1670,00
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Sectional specification for high density interconnect printed boards
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Published |
На языке оригинала
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4090,00
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