| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
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Copper-clad polyester film laminates for flexible printed circuits
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Published |
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На языке оригинала
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1339,00
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Test methods for copper-clad material for flexible printed circuits
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Published |
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На языке оригинала
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2333,00
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Sectional specification for single and double sided flexible printed board
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Published |
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На языке оригинала
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3499,00
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Adhesive coated polyester film for flexible printed circuits
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Published |
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На языке оригинала
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1339,00
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Adhesive coated polyimide film for flexible printed circuits
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Published |
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На языке оригинала
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1642,00
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General specification for printed circuit boards
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Published |
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На языке оригинала
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1642,00
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Polymide woven glass fabric copper clad laminated sheets for printed circuits
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Published |
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На языке оригинала
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1253,00
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Specification for flexible multilayer printed boards with through conections
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Published |
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На языке оригинала
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2549,00
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Specification for flex-rigid multilayer printed boards with through connections
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Published |
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На языке оригинала
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2549,00
|
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Printed board assemblies—Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
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Published |
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На языке оригинала
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2808,00
|
|
|
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Surface mounting technology—Part 3:Standard method for the specification of components for through hole reflow（THR）soldering
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Published |
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На языке оригинала
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1858,00
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Specifications for membrane key board
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Published |
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На языке оригинала
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1642,00
|
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General specification for metal foil for printed circuits
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Published |
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На языке оригинала
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1858,00
|
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Aluminium base copper clad laminate for printed circuits
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Published |
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На языке оригинала
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2117,00
|
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General rules for bonding sheet for multilayer printed boards
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Published |
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На языке оригинала
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1339,00
|
|
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Test methods for bongding sheet for multilayer printed boards
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Published |
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На языке оригинала
|
2808,00
|
|
|
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Quality assessment systems—Part 1: Registration and analysis of defects on printed board assemblies
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Published |
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На языке оригинала
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1339,00
|
|
|
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General specification for metal base copper-clad laminates for printed circuits
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Published |
|
На языке оригинала
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2333,00
|
|
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Aerospace electronic products—General specification for printed circuit board
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Published |
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На языке оригинала
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2117,00
|
|
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Requirements of flatness control for printed boards and printed board assemblies
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Published |
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На языке оригинала
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1253,00
|
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