| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 22%)
в рублях |
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Semiconductor devices-Mechanical and climatic test methods-Part 27: Electrostatic discharge(ESD) sensitivity testing-Machine model(MM)
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Published |
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На языке оригинала
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1282,00
|
|
|
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Semiconductor devices-Mechanical and climatic test methods-Part 29: Latch-up test
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Published |
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На языке оригинала
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2027,00
|
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Semiconductor devices-Mechanical and climatic test methods-Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
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Published |
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На языке оригинала
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1199,00
|
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Semiconductor devices-Mechanical and climatic test methods-Part 31:Flammability of platic-encapsulated devicesinternally induced
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Published |
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На языке оригинала
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993,00
|
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Semiconductor devices-Mechanical and climatic test methods-Part 32:Flammability of platic-encapsulated devicesexternally induced
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Published |
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На языке оригинала
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993,00
|
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Semiconductor devices-Mechanical and climatic test methods-Part 33: Accelerated moisture resistance-Unbiased autoclave
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Published |
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На языке оригинала
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1199,00
|
|
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Semiconductor devices-Mechanical and climatic test methods-Part 34:Power cycling
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Published |
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На языке оригинала
|
1282,00
|
|
|
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Semiconductor devices-Mechanical and climatic test methods-Part 35: Acoustic microscopy for plastic encapsulated electronic components
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Published |
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На языке оригинала
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1778,00
|
|
|
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Semiconductor devices-Mechanical and climatic test methods-Part 36:Accelerationsteady state
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Published |
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На языке оригинала
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1199,00
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Semiconductor devices-Mechanical and climatic test methods-Part 38: Soft error test method for semiconductor devices with memory
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Published |
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На языке оригинала
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1282,00
|
|
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Semiconductor devices-Mechanical and climatic test methods-Part 42:Temperature and humidity storage
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Published |
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На языке оригинала
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1199,00
|
|
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Semiconductor devices-Mechanical and climatic test methods-Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
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Published |
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На языке оригинала
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1778,00
|
|
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Semiconductor devices-Mechanical and climatic test methods-Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
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Published |
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На языке оригинала
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2233,00
|
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Letter symbols for discrete semiconductor devices
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Published |
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На языке оригинала
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3143,00
|
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Semiconductor devices--Sectional specification for discrete devices
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Published |
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На языке оригинала
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1572,00
|
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Semiconductor devices--Discrete devices and integrated circuits--Part 1:General
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Published |
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На языке оригинала
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3557,00
|
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Semiconductor devices - Discrete devices - Part 4: Microwave devices
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Published |
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На языке оригинала
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3598,00
|
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Semiconductor devices-Part 14-5:Semiconductor sensors-PN-junction semiconductor temperature sensor
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Published |
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На языке оригинала
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1572,00
|
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Semconductor devices Part 14-1: Semiconductor sensors - General and classification
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Published |
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На языке оригинала
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1199,00
|
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Semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors
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Published |
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На языке оригинала
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1282,00
|
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