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Materials for printed boards and other interconnecting structures - Part 2-18:Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad
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Materials for printed boards and other interconnecting structures - Part 2-19:Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
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Materials for printed boards and other interconnecting structures - Part 2-21:Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
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Materials for printed boards and other interconnecting structures - Part 2-31:Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4.1 at 1 GHz) and flammability (vertical burning test), copper-clad
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Materials for printed boards and other interconnecting structures - Part 2-32:Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3.7 at 1 GHz) and flammability (vertical burning test), copper-clad
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Materials for printed boards and other interconnecting structures - Part 2-33:Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4.1 at 1 GHz) and flammability (vertical burning test), copper-clad
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Materials for printed boards and other interconnecting structures - Part 2-34:Reinforced base materials, clad and unclad - Nonhalogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3.7 at 1 GHz) and flammability (vertical burning test), copper-clad
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Materials for printed boards and other interconnecting structures - Part 2-35:Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 2-36:Reinforced base materials clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 2-37:Reinforced base materials, clad and unclad - Modified non-halogenated expoide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 2-38:Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
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Materials for printed boards and other interconnecting structures - Part 3-1:Copper-clad laminates for flexible boards (Adhesive and non-adhesive types)
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Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
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Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
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