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Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
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Materials for printed boards and other interconnecting structures - Part 4-1:Sectional specification set for prepreg materials, unclad(for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
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Materials for printed boards and other interconnecting structures - Part 4-14:Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 4-15:Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 4-16:Sectional specification set for prepreg materials,unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test), for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 4-17:Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
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Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
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Material for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
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Material for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/Invar/copper
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Nuclear reactors - Instrumentation and control systems important for safety - Detection of leakage in coolant systems
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Electrical insulating materials and systems - AC voltage endurance evaluation
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Electroacoustics - Specifications for personal sound exposure meters
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Piezoelectric ceramic resonators - A specification in the IEC quality assessment system for electronic components (IECQ) - Part 1: Generic specification - Qualification approval
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Piezoelectric ceramic resonators - A specification in the IEC quality assessment system for electronic components(IECQ) - Part 2:Sectional specification - Qualification approval - Section 1:Blank detail specification - Assessment level E
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Piezoelectric ceramic resonators - A Specification in the IEC quality assessment system for electronic components (IECQ) - Part 2: Sectional specification-Qualification approval
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Electric shavers for household use - Methods for measuringthe performance
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Household electric heating pads - Methods for measuring performance
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Radiation protection instrumentation - Installed monitors for the detection of radioactive contamination of laundry
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Electroacoustics - Octave-band and fractional-octave-band filters - Part 1: Specifications
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Electroacoustics - Octave-band and fractional-octave-band filters
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