| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
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Environmental testing - Part 2-13: Tests - Test M: Low air pressure
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Environmental testing - Part 2-14: Tests - Test N: Change of temperature
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Basic environmental testing procedures Part 2:TGests - Test Q:Sealing
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Environmental testing - Part 2-18: Tests - Test R and guidance: Water
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Environmental testing - Part 2-20: Tests - Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
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Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
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Environmental testing - Part 2:Tests - Test Ea and guidance:Shock
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Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic(12 h + 12 h cycle)
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Environmental testing - Part 2-31: Tests - Test Ec: Rough handling shocks, primarily for equipment-type specimens
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Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
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Environmental testing - Part 2-39: Tests - Tests and guidance: Combined temperature or temperature and humidity with low air pressure tests
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Environmental testing - Part 2:Guidance on Test T:Soldering
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Environmental testing - Part 2-45: Tests - Test XA and guidance: Immersion in cleaning solvents
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Environmental testing - Part 2-47:Tests - Mounting of specimens for vibration, impact and similar dynamic tests
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Environmental testing - Part 2-52: Tests - Test Kb:Salt mist, cyclic(sodium chloride solution)
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Environmental testing - Part 2:Tests - Guidance to tests Z/AFc and Z/BFc:Combined temperature(cold and dry heat) and vibration(sinusoidal) tests
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Environmental testing - Part 2 - 54:Tests - Test Ta:Solderability testing of electronic components by the wetting balance method
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Environmental testing - Part 2-55: Tests - Test Ee and guidance - Loose cargo testing including bounce
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Environmental testing - Part 2-57: Tests - Test Ff: Vibration - Time-history and sine-beat method
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Environmental testing - Part 2 - 58:Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices(SMD)
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