| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
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Varistors for use in electronic equipment - Part 2:Sectional specification for surge suppression varistors
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Capacitors for power electronics
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Guide to the measurement of equivalent electrical parameters of quartz crystal units
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Quartz crystal units - A specification in the IEC quality assessment system for electronic components(IECQ) - Part 2:Sectional specification - Capability approval - Section 1:Blank detail specification
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Quartz crystal units - A specification in the IEC Quality Assessment System for Electronic Components (IECQ) - Part 2: Sectional specification – Capability approval
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Quartz crystal units - A specification in the IEC quality assessment system for electronic components(IECQ) - Part 3:Sectional specification - Qualification approval - Section 1:Blank detail specification
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Quartz crystal units - A specification in the IEC Quality Assessment System for Electronic Components (IECQ) -Part 3: Sectional specification - Qualification approval
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Printed board assembly products - Manufacturing description data and transfer methodology - Part 2 : Generic requirements
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Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
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Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
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Printed boards and printed board assemblies - Design and use - Part 5 - 1:Attachment(land/joint) considerations - Generic requirements
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Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
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Printed boards and printed board assemblies - Design and use - Part 7:Electronic component zero orientation for CAD library construction
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Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
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Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent(500 MHz to 10 GHz)
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2:Test methods for materials for interconnection structures
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3:Test methods for interconnection structures(printed boards)
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
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