| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
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Materials for printed boards and other interconnecting structures - Part 2-36:Reinforced base materials clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 2-37:Reinforced base materials, clad and unclad - Modified non-halogenated expoide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 2-38:Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
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Materials for printed boards and other interconnecting structures - Part 3-1:Copper-clad laminates for flexible boards (Adhesive and non-adhesive types)
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Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
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Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
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Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
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Materials for printed boards and other interconnecting structures - Part 4-1:Sectional specification set for prepreg materials, unclad(for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
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Materials for printed boards and other interconnecting structures - Part 4-14:Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 4-15:Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 4-16:Sectional specification set for prepreg materials,unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test), for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 4-17:Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
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Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
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Material for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
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Material for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/Invar/copper
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Piezoelectric ceramic resonators - A specification in the IEC quality assessment system for electronic components (IECQ) - Part 1: Generic specification - Qualification approval
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