Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%) в рублях |
|
Flexible display devices - Part 1-1: Terminology and letter symbols
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Flexible display devices - Part 2: Essential ratings and characteristics
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Flexible display devices - Part 5-1: Measuring methods of optical performance
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Flexible display devices - Part 6-1: Mechanical test methods - Deformation tests
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Flexible display devices - Part 6-3: Mechanical test methods - Impact and hardness tests
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Low resistance measurements - Methods and guidance
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 6: Test and evaluation methods for vertical contact mode triboelectric energy harvesting devices
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Device embedded substrate - Part 1-1: Generic specification - Test methods
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 2: Phase jitter measurement method
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 3: Frequency aging test methods
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 4: Short-term frequency stability test methods
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Printed electronics - Part 201: Materials - Substrates
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Printed electronics - Part 202: Materials - Conductive ink
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films Contactless method
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
Printed electronics - Part 204: Materials - Insulator ink - Measurement methods of properties of insulator inks and printed insulating layers
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
Страницы: ... / 20 / 21 / 22 / 23 / 24 / 25 / 26 / 27 / 28 / 29 / 30 |