| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
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Eyewear display - Part 20-20: Fundamental measurement methods - Image quality
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Eyewear display - Part 22-10: Specific measurement methods for AR type - Optical properties
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Guidelines for the measurement method of power durability for surface acoustic wave(SAW) and bulk acoustic wave(BAW) devices in radio frequency(RF) applications
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Semiconductor devices - Classification of defects in gallium nitride epitaxial film on silicon carbide substrate
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Test method for mechanical property of flexible opto – electric circuit boards under thermal stress
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Safety of laser products - Part 3: Guidance for laser displays and shows
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Safety of laser products - Part 5: Manufacturers checklist for KS C IEC 60825 - 1
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Safety of laser products - Part 8: Guidelines for the safe use of laser beams on humans
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Electronic component management plans
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Use of semiconductor devices outside manufacturers specified temperature range
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Measurement of quartz crystal unit parameters by zero phase technique in a pi-network - Part 4: Method for the measurement of the load resonance frequency f L , load resonance resistance R L and the calculation of other derived values of quartz crystal units, up to 30 MHz
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Safety of laser products - Part 13: Measurements for classification of laser products
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Safety of laser products - Part 14: A user’s guide
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
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Mnemonics and symbols for integrated circuits
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Guidelines for end-of-life information provided by manufacturers and recyclers and for recyclability rate calculation of electrical and electronic equipment
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Guidance on quantifying greenhouse gas emission reductions from the baseline for electrical and electronic products and systems
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Device embedded substrate - Part 2-2: Guidelines - Electrical testing
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Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
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Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
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