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Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO Level in the electronic assembly technology industries
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Printed electronics - Part 250: Materials technologies required in printed electronics for wearable smart devices
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Printed electronics - Part 402-4: Printability - Measurement of qualities - Classification and measurement methods for morphology
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Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations
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Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials
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Power capacitors for induction heating installations - Part 2: Ageing test, destruction test and requirements for disconnecting internal fuses
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Estimation of the reliability of electrical connectors
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Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection - Glossary - Part 3: Piezoelectric, dielectric and electrostatic oscillators
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Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection - Glossary - Part 5: Piezoelectric sensors
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Device embedded substrate - Part 2-1: Guidelines - General description of technology
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Device embedded substrate - Part 2-3: Guidelines - Design guide
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Device embedded substrate - Part 2-4: Guidelines - Test element groups(TEG)
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Wearable Electronic Devices and Technologies – Test methods for electrical properties of e-textiles
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Information technology - Telecommunications and information exchange between systems - Interface connector and contact assignments for ISDN basic access interface located at reference points S and T
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Wearable electronic devices and technologies - Part 406-1: Test method for measuring surface temperature of wrist-worn wearable electronic devices while in contact with human skin
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