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Materials for printed boards and other interconnecting structures - Part 4-16:Sectional specification set for prepreg materials,unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test), for lead-free assembly
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Materials for printed boards and other interconnecting structures - Part 4-17:Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
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Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
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Material for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
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Material for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/Invar/copper
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Printed boards - Part 1:Generic specification
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Printed boards - Part 4:Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1:Capability Detail Specification - Performance levels A, B, and C
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Printed boards - Part 4:Rigid multilayer printed boards with interlayer connections - Sectional specification
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Printed boards - Part 14:Device embedded substrate - Terminology/reliability/design guide
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Optical circuit boards - Basic test and measurement procedures - Part 2-5: Flexibility test for flexible opto-electric circuits
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Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
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Device embedded substrate - Part 1-1: Generic specification - Test methods
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Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
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Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
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Printed electronics - Part 201: Materials - Substrates
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Printed electronics - Part 202: Materials - Conductive ink
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Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films Contactless method
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Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
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Printed electronics - Part 204: Materials - Insulator ink - Measurement methods of properties of insulator inks and printed insulating layers
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Printed electronics - Part 401: Printability - Overview
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