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Printed electronics - Part 402-1: Printability - Measurement of qualities - Pattern width
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Printed electronics - Part 402-2: Printability - Measurement of qualities - Edge waviness
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Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine
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Test method for mechanical property of flexible opto – electric circuit boards under thermal stress
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
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Device embedded substrate - Part 2-2: Guidelines - Electrical testing
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Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
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Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
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Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO Level in the electronic assembly technology industries
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Printed electronics - Part 250: Materials technologies required in printed electronics for wearable smart devices
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Printed electronics - Part 402-4: Printability - Measurement of qualities - Classification and measurement methods for morphology
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Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations
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Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials
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Device embedded substrate - Part 2-1: Guidelines - General description of technology
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Device embedded substrate - Part 2-3: Guidelines - Design guide
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Device embedded substrate - Part 2-4: Guidelines - Test element groups(TEG)
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