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PD IEC TR 61189-5-506:2019 |  на печать | | Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501 |
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| | Библиография | Обозначение | PD IEC TR 61189-5-506:2019 | | Заглавие на английском языке | Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501 | | Количество страниц оригинала | 26 | |
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