| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
|
|
Essential ratings and characteristics for semiconductor pressure sensor elements
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
Principal measuring methods for semiconductor pressure sensor elements
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
Test methods of hot-film flow sensors
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
Test methods of semiconductor acceleration sensors
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
Pyroelectric infrared sensor
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
Semiconductor converters - Part 2:Self-commutated converters including direct d.c. converters
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
LED modules for general lighting - Safety specifications
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
Semiconductor devices - MEMS devices - Part 5: RF MEMS switches
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
DC or AC supplied electronic control gear for LED modules - Performance requirements
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 6: Test and evaluation methods for vertical contact mode triboelectric energy harvesting devices
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 2: Test method for defects using optical inspection
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
|
|
Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 3: Test method for defects using photoluminescence
|
|
|
На языке оригинала
|
Пишите на gost@gostinfo.ru
|
|
| Страницы: 1 / 2 |