| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
|
|
Electronic components—Long-term storage of electronic semiconductor devices—Part 5：Die and wafer devices
|
Published |
|
На языке оригинала
|
2189,00
|
|
|
|
Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 1: Classification of defects
|
Published |
|
На языке оригинала
|
2477,00
|
|
|
|
Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 2: Test method for defects using optical inspection
|
Published |
|
На языке оригинала
|
2477,00
|
|
|
|
Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 3: Test method for defects using photoluminescence
|
Published |
|
На языке оригинала
|
2477,00
|
|
|
|
Micro-electromechanical systems (MEMS) technology—Environmental test methods of MEMS piezoelectric thin films for sensor application
|
Published |
|
На языке оригинала
|
2477,00
|
|
|
|
Micro-electromechanical systems (MEMS) technology—Four-point bending test method for interfacial adhesion energy of layered MEMS materials
|
Published |
|
На языке оригинала
|
1786,00
|
|
|
|
Micro-electromechanical systems (MEMS) technology—Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
|
Published |
|
На языке оригинала
|
2189,00
|
|
|
|
Micro-electromechanical systems (MEMS) technology—Wafer curvature and cantilever beam deflection test methods for determining residual stresses of MEMS films
|
Published |
|
На языке оригинала
|
1786,00
|
|
|
|
Micro-electromechanical systems（MEMS）technology—Radio frequency MEMS circulators and isolators
|
Published |
|
На языке оригинала
|
3398,00
|
|
|
|
Micro-electromechanical systems（MEMS）technology—Technical specification of automotive grade pressure sensor based on MEMS technology
|
Published |
|
На языке оригинала
|
2189,00
|
|
|
|
Electrostatic discharge sensitivity testing—Transmission line pulse(TLP)—Component level
|
Published |
|
На языке оригинала
|
2477,00
|
|
|
|
Micro-electromechanical systems (MEMS) technologyдёЂMicro-pillar compression test for MEMS materials
|
Published |
|
На языке оригинала
|
2189,00
|
|
|
|
Micro-electromechanical systems （MEMS） technology—Bend testing methods of thin film materials
|
Published |
|
На языке оригинала
|
1786,00
|
|
|
|
Micro-electromechanical systems (MEMS) technology—Forming limit measuring method of metallic film materials
|
Published |
|
На языке оригинала
|
2477,00
|
|
| Страницы: 1 / 2 / 3 / 4 / 5 |