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Semiconductor devices - Mechanical and climatic test methods - Part 1:General
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Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
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Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
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Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state,highly accelerated stress test(HAST)
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Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
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Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
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Semiconductor devices - Mechanical and climatic test methods - Part 8:Sealing
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Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
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Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
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Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
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Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
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Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
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Semiconductor devices - Mechanical and climatic test methods - Part 14:Robustness of terminations(lead integrity)
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Semiconductor devices - Mechanical and climatic test methods - Part 16:Particle impact noise detection(PIND)
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Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
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Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation(total dose)
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Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
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Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
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