| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
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Prepreg for multilayer printed wiring boards (Epoxy resin-Impregnated glass cloth)
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Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified,woven E-glass reinforced laminated sheets of defined flammability(vertical burning test), copper-clad
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Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
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Printed board design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
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Base materials for printed circuits - Part 1: Test methods
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Printed boards - Part 10: Specification for flex-rigid double-sided printed boards with through connections
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Printed board assembly products - Manufacturing description data and transfer methodology - Part 2 : Generic requirements
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Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
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Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
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Printed boards and printed board assemblies - Design and use - Part 5 - 1:Attachment(land/joint) considerations - Generic requirements
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Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
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Printed boards and printed board assemblies - Design and use - Part 7:Electronic component zero orientation for CAD library construction
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
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Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent(500 MHz to 10 GHz)
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2:Test methods for materials for interconnection structures
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3:Test methods for interconnection structures(printed boards)
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
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