| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
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Semiconductor integrated circuits—Test methods of PWM controller
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Published |
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На языке оригинала
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3715,00
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Integrated circuit—Test method for CMOS image sensors
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Published |
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На языке оригинала
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2549,00
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Surface acoustic wave (SAW) and bulk acoustic wave(BAW) duplexers of assessed quality—Part 1:Generic specification
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Published |
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На языке оригинала
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2160,00
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Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality—Part 2:Guidelines for the use
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Published |
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На языке оригинала
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1987,00
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General specification for separable and break-off connectors for aerospace
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Published |
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На языке оригинала
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3283,00
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Requirements for analog/mixed-signal intellectual property(IP) core deliverables
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Published |
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На языке оригинала
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1253,00
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Guideline for analog/mix-signal intellectual property(IP) core document structure
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Published |
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На языке оригинала
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2333,00
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Design requirements of integrated circuit intellectual property (IP) core
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Published |
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На языке оригинала
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1339,00
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Analog/mixed-signal intellectural property(IP)core quality evaluation
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Published |
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На языке оригинала
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2117,00
|
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Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 1: Classification of defects
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Published |
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На языке оригинала
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1858,00
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Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 2: Test method for defects using optical inspection
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Published |
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На языке оригинала
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1858,00
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Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 3: Test method for defects using photoluminescence
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Published |
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На языке оригинала
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1858,00
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Test method of performance for lobster eye micro pore optics
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Published |
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На языке оригинала
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1642,00
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Three dimensional integrated circuit—Part 1：Terminologies and definitions
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Published |
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На языке оригинала
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1642,00
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Three dimensional integrated circuits—Part 2：Alignment of stacked dies having fine pitch interconnect
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Published |
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На языке оригинала
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1339,00
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Quality and technical requirements for metal packages used for integrated circuits
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Published |
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На языке оригинала
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2549,00
|
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Laser display devices—Part 1-2：Vocabulary and letter symbols
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Published |
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На языке оригинала
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1339,00
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Laser display devices—Part 5-1: Measurement of optical performance for laser front projection
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Published |
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На языке оригинала
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3024,00
|
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Laser display devices—Part 5-2: Optical measuring methods of speckle contrast
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Published |
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На языке оригинала
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1642,00
|
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Laser display devices—Part 5-3: Measuring methods of image quality for laser projection displays
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Published |
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На языке оригинала
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2117,00
|
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| Страницы: ... / 35 / 36 / 37 / 38 / 39 / 40 / 41 / 42 / 43 / 44 / 45 / 46 |