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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2:Test methods for materials for interconnection structures
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3:Test methods for interconnection structures(printed boards)
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies
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Test methods for electrical materials, interconnection structures and assemblies - Part 5:Test methods for printed board assemblies
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Test methods for electrical materials, interconnection structures and assemblies - Part 6:Test methods for materials used in manufacturing electronic assemblies
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
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Attachment materials for electronic assembly - Part 1 - 1:Requirements for soldering fluxes for high-quality interconnections in electronics assembly
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
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Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
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Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
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Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
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Workmanship requirements for soldered electronic assemblies - Part 3:Through-hole mount assemblies
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Workmanship requirements for soldered electronic assemblies - Part 4:Terminal assemblies
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Workmanship requirements for soldered electronic assemblies - Part 5:Rework, modification and repair of soldered electronic assemblies
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