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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
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Test methods for electrical materials, interconnection structures and assemblies - Part 5:Test methods for printed board assemblies
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Test methods for electrical materials, interconnection structures and assemblies - Part 6:Test methods for materials used in manufacturing electronic assemblies
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Attachment materials for electronic assembly - Part 1 - 1:Requirements for soldering fluxes for high-quality interconnections in electronics assembly
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Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
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Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
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Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
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Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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Workmanship requirements for soldered electronic assemblies - Part 3:Through-hole mount assemblies
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Workmanship requirements for soldered electronic assemblies - Part 4:Terminal assemblies
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Workmanship requirements for soldered electronic assemblies - Part 5:Rework, modification and repair of soldered electronic assemblies
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Quality assessment systems - Part 1:Registration and analysis of defects on printed board assemblies
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Quality assessment systems - Part 2:Selection and use of sampling plans for inspection of electronic components and packages
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Piezoelectric devices - Preparation of outline drawings of surfacemounted devices(SMD) for frequency control and selection - General rules
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Materials for printed boards and other interconnecting structures - Part 2 - 1:Reinforced base materials,clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
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Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
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Materials for printed boards and other interconnecting structures - Part 2-5:Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability(vertical burning test), copper-clad
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Materials for printed boards and other interconnecting structures - Part 2-6:Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability(vertical burning test), copper-clad
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Materials for printed boards and other interconnecting structures - Part 2 - 7:Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability(vertical burning test), copper-clad
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